Télécharger le livre :  Designing TSVs for 3D Integrated Circuits
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This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar...

Editeur : Springer
Parution : 2012-09-22
Collection : SpringerBriefs in Electrical and Computer Engineering
ePub

52,74