Ebooks de Shichun Qu en EPUB

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Wafer-Level Chip-Scale Packaging
Yong Liu , Shichun Qu
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on...

Editeur : Springer
Parution : 2014-09-10

ePub

158,24 €