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Three Dimensional System Integration
Antonis Papanikolaou , Riko Radojcic , Dimitrios Soudris
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in...

Editeur : Springer
Parution : 2010-12-07

ePub

52,74 €