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Electromigration Modeling at Circuit Layout Level

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Paru le : 2013-03-16

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has n...
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Description du livre

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

À propos

Auteur
Feifei He , Cher Ming Tan
Éditeur
Springer
Collection
SpringerBriefs in Applied Sciences and Technology
Parution
2013-03-16
Pages
103 pages
EAN papier
9789814451208

Auteur(s) du livre


Defaut-Illustration Feifei He
Defaut-Illustration Cher Ming Tan

Caractéristiques détaillées - droits

EAN EPUB
9789814451215
Prix
52,74 €
Nombre pages copiables
1
Nombre pages imprimables
10
Taille du fichier
3963 Ko
Ce livre est accessible aux handicaps informations d'accessibilité

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